PCB Assembly Capability
PCBA Manufacturing Capabilities | Special Procedure | |||
Item | Parts | Capability | Parts | Yes/No |
PCB Size
|
Max | 1500*460mm | Aluminum board/FPC | Y |
Min | 50*50mm | POP | Y | |
Thickest | 5mm | N2 soldering | Reserved N2 interface | |
Thinnest | 0.5mm | UV curing | Y | |
SMT
|
Max | 150*150*25mm | PCBA cleaning | Y |
Min | 0201(inch) | pressure welding | Y | |
SMT Min Pitch | 0.3mm QFN | conformal coating | Y | |
BGA Min Pitch | 0.35mm BGA | high and low temperature cyclic aging | Y | |
Wave Soldering |
Max Width | 550mm | ||
Min Width | 12mm |
PCB Assembly Procedure