Technical Capacity

ITEM Capability/td>
Month Capability 1000types/month,8,000sqm/month
Board Material Standard FR4: Shengyi, ITEQ, KB, GDM High TG: S1000-2, IT180 
Surface treatment OSP, HASL, LF-HASL, ENIG(Chem. Gold), Immersion Tin, Immersion silver, Plating hard gold, Gold fingers,Flash gold, ENEPIG  
Tolerance Board thickness tolerance 1.0mm: +/-0.1mm 1.0mm-2.0mm: +/-10% >2.0mm: +/-8% 
Hole diameter tolerance PTH: +/-0.075mm NPTH:+/-0.05mm
Hole location tolerance: +/-0.075mm
Outline tolerance: < 100mm: +/-0.1mm 100mm-300mm: +/-0.15mm 300mm: +/-0.2mm
Technical Specification Layers: 1-24 layers
Min line width/space: 0.075/0.075mm
Min hole: 0.15mm (mechanical drilling) 0.1mm (laser drilling)
Min pad ring: 0.1mm
Max copper thickness: 12oz
Max board size:1-2 layers: 635 X 1100mm Multilayers: 500 X 1100mm
Board thickness: 2-layers: 0.2-7.0mm Multi-layers: 0.4-7.0mm Inner layers: 0.1mm
Board warpage: ≤1°
Min solder mask bridge: 0.08mm
Aspect Ration: 8:1
Plugging Vias capability: 0.2-0.8mm
Au, Ni thickness control: 1. Chem gold: Au:1-10u” 2. Gold fingers: Au:1-150u” 3. Flash gold: Au:1-10u” 4. Hard gold:Au:1-150u” 5. Ni thickness:50-1000u” 6. ENEPIG: Au:1-8u”,Pd:2-5u

Production Equipment

Process

  • Start
  • Incoming
    Inspection
  • Cutting
  • Multi-layer boards
  • 2-layer boards
  • Inner image
    transfer
  • Drilling Hole
  • Etching
  • PTH
  • panel Plating
  • AOI
  • Out-layer image transfer
  • Inner Brown
    oxide
  •       QC
    Inspection
  • pressing
  • pattern
    plating
  • Flash
    Gold
  • Etching
  • QC Inspection
  • W/F
  • QC
    Inspection
  • C/M
  • HAL
  • Immer-sion
    Gold
  • OPS Flash Good/
    Immersion Tin, silver/osp
  •      QC
    Inspection
  • Punching&
    Routing
  • V-CUT
    v-cutting
  • E-TEST
  • FQC
  • OSP
  • Immersion
    Tin silver
  • HAL/Flash Gold
    Immersion Gold
  • FQA
  • FQA
  • Packing
  • Storage
  • Shipment